DEVICE FOR LAMINATING MICROCHIP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a device for laminating a microchip substrate which can surely laminate a chip substrate made of a resin while the shape of a minute channel part formed in the chip substrate is maintained and obtain a high quality microchip at a low production cost.

SOLUTION: A light transmitting chip substrate and a light absorbing chip substrate are laminated by the device while being arranged to overlap each other. The minute channel part specified in width and depth is formed in at least one of surfaces to be joining surfaces in the light transmitting chip substrate and the light absorbing chip substrate. The device is equipped with a pressurization mechanism pressurizing the light transmitting chip substrate and the light absorbing chip substrate arranged to overlap each other in the overlapping direction and a flush light-irradiation means irradiating the light absorbing chip substrate with light through the light transmitting chip substrate. By the flush light radiation means, light is emitted according to specified operation conditions.

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