IC TAG, METHOD FOR MANUFACTURING IC TAG, DEVICE FOR MANUFACTURING IC TAG, INTERPOSER, METHOD FOR MANUFACTURING INTERPOSER AND DEVICE FOR MANUFACTURING INTERPOSER

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC tag for electrically connecting and hardly fixing a conductor functioning as an antenna to an IC chip without heating it.

SOLUTION: This method for manufacturing an IC tag is provided with a process for supplying UV hardening adhesive 36 on an antenna base material 20, a process for arranging an IC chip 16 through the UV hardening adhesive on the antenna base material, and a process for hardening the UV hardening adhesive by emitting UV rays of light. The antenna base substrate is provided with a base material 21 and a conductor 24 adhered through thermoplastic adhesive 32 on the base material. The IC chip is arranged on the antenna base material so that a connection electrode 16a of the IC chip can be faced to the conductor.

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