SUBSTRATE FOR SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEALING METAL MOLD

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor device and a manufacturing method of the semiconductor device in which a removing coefficient of an individual substrate piece for the substrate for the semiconductor device can be improved, individual substrate piece cost and manufacturing cost by the improvement of production efficiency can be reduced, and moreover the cost reduction of the semiconductor device is achieved.

SOLUTION: The substrate 1 for the semiconductor device forming a circuit substrate region 3 where a plurality of substrate pieces 2 providing wiring patterns and semiconductor element mounting areas are allocated in the shape of a matrix. The circuit substrate region 3 of the substrate 1 for the semiconductor device is formed toward the external circumference of the substrate 1 for the semiconductor device to surround the circuit substrate region 2 from the external circumference, and the external circumferential frame is also formed without including the semiconductor element mounting area. By this structure, an effective region can be expanded used as the individual substrate piece 2 for the internal side of the substrate 1 for the semiconductor device, and thereby the removing coefficient can be improved in the individual substrate piece 2.

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