发明名称 DEVELOPING DEVICE AND DEVELOPING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of particles in a developing device which does not make a wafer rotate. SOLUTION: The developing device for substrates has a delivery unit 11 and a developing unit 12 formed in parallel in a process chamber 10, a transporting mechanism 13 for transporting a wafer W between the delivery unit 11 and the developing unit 12 in the condition that both outer sides of the wafer W are gripped from both sides, and a developer supply nozzle 50 and an air blowing nozzle 51 provided above the wafer transport path of the transporting mechanism 13 between the delivery unit 11 and the developing unit 12. The developing unit 12 includes a cleaning liquid supply nozzle 80 formed approximately in U shape, with the upper and lower surface of the wafer W held in-between. The nozzle 80 moves along the wafer W with discharging the cleaning liquid to supply the cleaning liquid to the both sides of the wafer W. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007042860(A) 申请公布日期 2007.02.15
申请号 JP20050225249 申请日期 2005.08.03
申请人 TOKYO ELECTRON LTD 发明人 KITANO TAKAHIRO;AKUMOTO MASAMI;NISHIKIDO SHUICHI;KUMAGAI MASARU
分类号 H01L21/027 主分类号 H01L21/027
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