| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder joining structure and a solder joining method whereby solder a joining portion where a leadless chip carrier is joined to a mounting substrate is damaged hardly. SOLUTION: A solder joining structure 10 is the one whereby there are joined to each other a leadless chip carrier 12 and an organic substrate 22 for mounting thereon the leadless chip carrier 12 which have different linear-expansion-coefficients from each other. Each electrode 16 is formed in a leadless chip carrier substrate 14 constituting the leadless chip carrier 12, and the thickness of each solder joining portion 20 which joins by solder each electrode 16 to each solder-joined portion 23 of the organic substrate 22 is made to fall within a predetermined scope. COPYRIGHT: (C)2007,JPO&INPIT
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