| 摘要 |
The invention relates to a method for aligning two flat substrates with one another, wherein each substrate has at least one aligning mark for mutual alignment, particularly for aligning a mask with a wafer before exposure. After aligning the two substrates in a first aligning step by optically determining the position of the alignment mark of the first substrate, storing the position of the first substrate, and moving the second substrate parallel to the first substrate so that the alignment mark of the second substrate corresponds with the stored position of the alignment mark of the first substrate, in a second aligning step the alignment is verified and a fine adjustment is carried out if necessary. In this second step the alignment marks of both substrates are observed essentially simultaneously, and both substrates are aligned with one another by a relative movement parallel to the substrate plane.
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