| 摘要 |
A circuit substrate includes a carrier, at least one non-conductive diamond-like carbon layer provided on a top surface of the carrier, at least one conductive film-coating layer provided on a surface of the non-conductive diamond-like carbon layer and in the form of a conductive logical circuitry, an upper non-conductive diamond-like carbon layer provided on a surface of the conductive film-coating layer, and a plurality of soldering pads downwardly extended through the upper non-conductive diamond-like carbon layer to bond to the conductive film-coating layer and serve as soldering points for connecting the conductive film-coating layer to external elements. The non-conductive diamond-like carbon layers provide super-high thermal conductivity and heat-radiating ability to enhance the heat-radiating ability of the circuit substrate, enabling the circuit substrate to have increased transmission and operation rates and prolonged usable life.
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