发明名称 Multilayer solder article
摘要 A multilayer solder article includes a layer of a first non-lead solder for bonding to an electrically conductive material. A layer of a second non-lead solder can be on the layer of the first solder. The second solder can have a lower melting temperature than the first solder. The melting temperature of the second solder can be below about 310° F.
申请公布号 US2007037004(A1) 申请公布日期 2007.02.15
申请号 US20050202640 申请日期 2005.08.12
申请人 ANTAYA TECHNOLOGIES CORPORATION 发明人 PEREIRA JOHN
分类号 B32B15/01 主分类号 B32B15/01
代理机构 代理人
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