| 摘要 |
A modular laser assembly has a laser-fiber housing comprising a semiconductor laser optically coupled to an end of an optical fiber, the laser-fiber housing having electrical leads electrically coupled to the laser and extending from a front face of the laser-fiber housing; a mounting platform comprising laser interfacing circuitry and contacts electrically coupled thereto, an opening for receiving the laser-fiber housing wherein when said laser-fiber housing is mounted to the mounting platform the electrical leads are proximate and may be electrically coupled to the contacts, and a plurality of pins electrically coupled to said interfacing circuitry and extending laterally from opposing sides of the mounting platform; and a temperature controlling element for mounting to and controlling the temperature of the laser-fiber housing.
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