METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

摘要

A method for manufacturing an electronic component exhibiting excellent bonding strength to a packaging substrate, in which the impact of external stress onto the packaging substrate is suppressed while simplifying the structure and variation in characteristics is restrained at a part functioning as an electronic component. An element substrate (2) provided with a functional part functioning as an electronic component and an electrode (9) for external connection is prepared, a case board (3) exhibiting low sandblast resistance is stuck onto the element substrate (2) through an adhesive layer (5) exhibiting high sandblast resistance, a hole (3f) is bored in the case board (3) above the electrode (9) for external connection such that the adhesive layer (5) is exposed to the outside by sandblasting, the adhesive layer portion exposed in the hole (3f) is removed by etching, an electrode film (7A) is formed to be connected electrically with the exposed electrode (9) for external connection, and a protrusion (3b) is formed by machining such that an terminal electrode derived from the electrode film (7A) is formed on the forward end face.