发明名称 SUBSTRATE PROCESSING APPARATUS, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 Disclosed is a substrate processing apparatus wherein the temperature in a reaction tube can be controlled accurately. Specifically disclosed is a substrate processing apparatus comprising a reaction tube (42) in which a substrate is processed, a heater (46) for heating the substrate in the reaction tube (42), a cooling air channel (72) for flowing a cooling air (70) along the outer side of the reaction tube (42), and a thermocouple (82) for detecting the temperature around the reaction tube (42). The thermocouple (82) is covered with a protective tube (86) and arranged within the cooling air channel (72) in which the cooling air (70) is circulated, and a cover member (88) is provided on the outside of protective tube (86) for blocking the flow of the cooling air (70) toward the protective tube (86).
申请公布号 WO2007018142(A1) 申请公布日期 2007.02.15
申请号 WO2006JP315482 申请日期 2006.08.04
申请人 HITACHI KOKUSAI ELECTRIC INC.;YAMAZAKI, KEISHIN;NAKAMURA, IWAO;SASAJIMA, RYOTA 发明人 YAMAZAKI, KEISHIN;NAKAMURA, IWAO;SASAJIMA, RYOTA
分类号 H01L21/324;H01L21/22;H01L21/31 主分类号 H01L21/324
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