发明名称 |
SUBSTRATE PROCESSING APPARATUS, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
Disclosed is a substrate processing apparatus wherein the temperature in a reaction tube can be controlled accurately. Specifically disclosed is a substrate processing apparatus comprising a reaction tube (42) in which a substrate is processed, a heater (46) for heating the substrate in the reaction tube (42), a cooling air channel (72) for flowing a cooling air (70) along the outer side of the reaction tube (42), and a thermocouple (82) for detecting the temperature around the reaction tube (42). The thermocouple (82) is covered with a protective tube (86) and arranged within the cooling air channel (72) in which the cooling air (70) is circulated, and a cover member (88) is provided on the outside of protective tube (86) for blocking the flow of the cooling air (70) toward the protective tube (86). |
申请公布号 |
WO2007018142(A1) |
申请公布日期 |
2007.02.15 |
申请号 |
WO2006JP315482 |
申请日期 |
2006.08.04 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC.;YAMAZAKI, KEISHIN;NAKAMURA, IWAO;SASAJIMA, RYOTA |
发明人 |
YAMAZAKI, KEISHIN;NAKAMURA, IWAO;SASAJIMA, RYOTA |
分类号 |
H01L21/324;H01L21/22;H01L21/31 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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