| 发明名称 |
Integrated solder and heat spreader fabrication |
| 摘要 |
A system may include an integrated heat spreader that includes a portion of solder material and a thermal conductor, wherein a voidless interface exists between the solder material and a first side of the thermal conductor.
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| 申请公布号 |
US2007035012(A1) |
申请公布日期 |
2007.02.15 |
| 申请号 |
US20060580377 |
申请日期 |
2006.10.13 |
| 申请人 |
DEPPISCH CARL L;MARTIN EDWARD L;HOULE SABINA J;MELLODY JAMES P;BURGESS MARVIN J;BROWN MAUREEN A;DEBLIECK ROBERT C;CARROLL DAVID P |
发明人 |
DEPPISCH CARL L.;MARTIN EDWARD L.;HOULE SABINA J.;MELLODY JAMES P.;BURGESS MARVIN J.;BROWN MAUREEN A.;DEBLIECK ROBERT C.;CARROLL DAVID P. |
| 分类号 |
H01L23/34;H01L23/42 |
主分类号 |
H01L23/34 |
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