| 摘要 |
A semiconductor wafer pod is provided to fix a bottom surface and a lateral surface of a cassette by forming a sub-grip arm extended in parallel to a grip arm in order to support a lateral surface of a wafer cassette. A semiconductor wafer pod includes a main pod body(10) for receiving a silicon wafer(20), a grip arm(15) for supporting a wafer carrier cassette(30) in which silicon wafers are stacked, and a pod plate(13) positioned at a lower part of the grip arm in order to perform an elevation operation. A sub-grip arm is installed at the grip arm and is extended in parallel to the grip arm in order to support a lateral surface of the wafer carrier cassette. The sub-grip arm is inserted into a guide groove formed at a lateral surface of a lower part of the wafer carrier cassette.
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