PHOTORESIST COATING APPARATUS AND METHOD FOR OPERATING THE APPARATUS

摘要

A photoresist coating apparatus and a coating method of a photoresist using the same are provided to decrease generation of edge beads even without reducing the speed of photoresist coating process by supplying solvent having high boiling point or surfactant into an edge part of wafer. The photoresist coating apparatus includes: wafer substate(511) for supporting a wafer(512); a photoresist nozzle(520) for feeding a photoresist solution(513) to the wafer(512); and at least one HBP(high boiling point) solvent nozzle(530) for feeding to an edge of the wafer(512), a HBP solvent(531) having a boiling point above that of a solvent contained in the photoresist solution, or a surfactant nozzle for feeding a surfactant to a surface of the photoresist solution fed onto the edge of wafer(512).