Device and method for inspecting the surface of a wafer

摘要

The device has a lighting mechanism (30) for a detection area (12) on the inspected surface of a wafer (10) using light with wide-band spectrum, and an optical detection mechanism (50) provided with a camera (51). The camera is arranged to coordinate with the polychrome light source (31) of lighting mechanism. A filter arrangement (33) is arranged with respect to lighting mechanism to selectively cover lighting with narrow-band spectra. The lighting mechanism is aligned to the optical detection mechanism. The narrow-band spectra lie in the visible ranges of red, green and blue colors. An independent claim is included for the wafer surface inspection method.