Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process,申请号GB20050021254-传众专利搜索

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发明名称	Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process
摘要
申请公布号	GB2418067(B)	申请公布日期	2007.02.14
申请号	GB20050021254	申请日期	2003.12.22
申请人	ADVANCED MICRO DEVICES, INC	发明人	GERD FRANZ MARXSEN;AXEL PREUSSE;MARKUS NOPPER;FRANK MAUERSBERGER
分类号	H01L21/768;H01L21/288	主分类号	H01L21/768
代理机构		代理人
主权项
地址

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