| 发明名称 |
Semiconductor package assembly and method for electrically isolating modules |
| 摘要 |
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
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| 申请公布号 |
US7176566(B2) |
申请公布日期 |
2007.02.13 |
| 申请号 |
US20050040575 |
申请日期 |
2005.01.20 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
QUINLAN SION C.;BALES TIM J. |
| 分类号 |
H01L23/34;H01L23/02;H01L23/06;H01L23/64 |
主分类号 |
H01L23/34 |
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