发明名称 |
Damascene patterning of barrier layer metal for C4 solder bumps |
摘要 |
A system and method for forming a novel C 4 solder bump for BLM (Ball Limiting Metallurgy) includes a novel damascene technique is implemented to eliminate the Cu undercut problem and improve the C 4 pitch. In the process, a barrier layer metal stack is deposited above a metal pad layer. A top layer of the barrier layer metals (e.g., Cu) is patterned by CMP. Only bottom layers of the barrier metal stack are patterned by a wet etching. The wet etch time for the Cu-based metals is greatly reduced resulting in a reduced undercut. This allows the pitch of the C 4 solder bumps to be reduced. An alternate method includes use of multiple vias at the solder bump terminal.
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申请公布号 |
US7176583(B2) |
申请公布日期 |
2007.02.13 |
申请号 |
US20040710562 |
申请日期 |
2004.07.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG |
分类号 |
H01L23/52;H01L23/40;H01L23/48;H01L23/485;H01L23/498 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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