发明名称 Molded electronic components
摘要 Techniques for making robust but precise electrical components, such as molded equalizers designed for interface with amplifiers in CATV or other communications equipment, are disclosed. An exemplary embodiment of an electrical component includes an injection-molded housing encapsulating an equalizer circuit and with pins protruding from one end. The housing and pins are designed for interface with predetermined locations in CATV amplifiers or optic nodes. The addition of the molten plastic changes the performance of the equalizer circuit, requiring pre-mold adjustments to the circuit design to be made in order for the final molded equalizer to achieve the desired operating characteristics.
申请公布号 US7177143(B1) 申请公布日期 2007.02.13
申请号 US20050033931 申请日期 2005.01.11
申请人 COMMUNICATION ASSOCIATES, INC. 发明人 GOMEZ LEONARDO
分类号 G06F1/16;H04B7/185 主分类号 G06F1/16
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