发明名称 Electronically grounded heat spreader
摘要 Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.
申请公布号 US7176563(B2) 申请公布日期 2007.02.13
申请号 US20030665997 申请日期 2003.09.18
申请人 INTERNATIONAL BUSINESS MACHINE CORPORATION 发明人 DUCHESNE ERIC;GAYNES MICHAEL A.
分类号 H01L23/34;H01L23/373 主分类号 H01L23/34
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