发明名称 |
Electronically grounded heat spreader |
摘要 |
Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.
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申请公布号 |
US7176563(B2) |
申请公布日期 |
2007.02.13 |
申请号 |
US20030665997 |
申请日期 |
2003.09.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINE CORPORATION |
发明人 |
DUCHESNE ERIC;GAYNES MICHAEL A. |
分类号 |
H01L23/34;H01L23/373 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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