Method of fabricating a micro-electromechanical device with a thermal actuator

摘要

A method of fabricating a micro-electromechanical device includes the step of forming electrical connections to drive circuitry on a wafer substrate. A first sacrificial structure is formed on the wafer substrate. The first sacrificial structure corresponds at least to a mechanical arm to be formed on the sacrificial structure, spaced from the wafer substrate. At least the mechanical arm is formed on the sacrificial structure. A second sacrificial structure is formed on the wafer substrate such that the second sacrificial structure corresponds at least to a heater element to be connected to the electrical connections, isolated from and overlying the mechanical arm. The heater element is formed on the second sacrificial structure. A third sacrificial structure is formed on the wafer substrate such that the third sacrificial structure corresponds at least to a structural formation that serves to fasten the heater element to the mechanical arm at a position spaced from the electrical connections such that resistive heating and subsequent cooling of the heater element as a result of an electrical current passing through the heater element results in displacement of the structural formation relative to the substrate. The structural formation is formed on the wafer substrate.