| 摘要 |
A PGA IC socket, in which socket contacts are arranged at high density, and that performs positioning of an IC package without inhibiting the high density arrangement of the socket contacts. The PGA type IC socket contains a large number of socket contacts for contacting a large number of lead pins of an electrical device; a socket housing, in which a large number of cavities for housing the socket contacts are arranged in a matrix; and a drive portion for moving the lead pins. Each of the socket contacts has a pair of narrowly spaced resilient contact portions for contacting a lead pin. Cutouts, which are open toward the electrical device, are formed in walls of the cavities, such that cavities which are adjacent in the direction perpendicular to the lead pins are in communication with each other.
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