| 发明名称 |
Method and apparatus for processing electronic parts |
| 摘要 |
An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.
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| 申请公布号 |
US7176402(B2) |
申请公布日期 |
2007.02.13 |
| 申请号 |
US20040969274 |
申请日期 |
2004.10.21 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OKUMURA TOMOHIRO;SUETSUGU KENICHIRO;KAWAZOE HIROSHI;SAITOH MITSUO;FURUSAWA AKIO |
| 分类号 |
B23K10/00;H01F41/10;H05K3/28;H05K3/34 |
主分类号 |
B23K10/00 |
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