发明名称 Semiconductor devices having contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus
摘要 Forming a semiconductor device can include forming an insulating layer on a semiconductor substrate including a conductive region thereof, wherein the insulating layer has a contact hole therein exposing a portion of the conductive region. A polysilicon contact plug can be formed in the contact hole wherein at least a portion of the polysilicon contact plug is doped with an element having a diffusion coeffient that is less than a diffusion coefficient of phosphorus (P). Related structures are also discussed.
申请公布号 US7176533(B2) 申请公布日期 2007.02.13
申请号 US20040982113 申请日期 2004.11.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHUNG EUN-AE;LEE MYOUNG-BUM;KIM YOUNG-PIL;KIM JIN-GYUN;JIN BEAN-JUN
分类号 H01L21/28;H01L29/76;H01L21/225;H01L21/285;H01L21/768;H01L23/485 主分类号 H01L21/28
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