| 摘要 |
FIELD: thermoelectric instrumentation engineering; electrochemical method for applying anti-diffusion barrier. ^ SUBSTANCE: proposed method includes chemical treatment of plates and electrochemical nickel-plating of plate surfaces. Chemical treatment is conducted in three steps: first plates are treated with alkali solution, then with solution incorporating mixture of sulfuric and nitric acids doped with iodine ions, and finally with solution incorporating mixture of hydrofluoric and sulfuric acids. Prior to electrochemical deposition of nickel surface layers of plates are subjected to electrochemical etching in electrolyte for nickel-plating by uniformly increasing cathodic current density to 10 - 50 mA/cm2 for 1.0 = 1.5 minutes. ^ EFFECT: enhanced adhesive properties of anti-diffusion barrier. ^ 4 cl |
