发明名称 |
A heat conductive material |
摘要 |
<p>This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of such materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles silicone carbide and silicon and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm<SUP>2</SUP>/s.</p> |
申请公布号 |
HK1072929(A1) |
申请公布日期 |
2007.02.09 |
申请号 |
HK20050104806 |
申请日期 |
2005.06.08 |
申请人 |
SKELETON TECHNOLOGIES AG |
发明人 |
THOMMY EKSTROM;JIE ZHENG;KAUTHAR KLOUB;GORDEEV, SERGEY, K.;DANCHUKOVA, LIYA, V. |
分类号 |
C01B31/06;C04B;C01B31/36;C04B35/52;H01L;H01L23/373 |
主分类号 |
C01B31/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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