| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure a height of a bump electrode or make uniform the height of the bump electrode to be formed. <P>SOLUTION: In a manufacturing method of a semiconductor device which forms the bump electrode in a pad of a semiconductor substrate, it comprises the steps of forming the bump electrode in a substrate for forming the bump electrode different from the semiconductor substrate; opposing the semiconductor substrate to the substrate for forming the bump electrode formed with the bump electrode, forming a connection layer between the semiconductor substrate and the bump electrode, and integrating the semiconductor substrate and the bump electrode by this connection later; and separating the bump electrode from the substrate for forming the bump electrode, and forming the bump electrode composed of the bump electrode and the connection layer in the pad of the semiconductor substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
