发明名称 MICRO-MIRROR ELEMENT PACKAGE AND METHOD FOR FABRICATING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method with which a micro-mirror element package can be fabricated through a batch step performed in terms of a wafer size. <P>SOLUTION: The micro-mirror element package includes a micro-mirror element; a substrate, on which the micro-mirror element is mounted; and a window lid mounted on the substrate to cover the micro-mirror element. The window lid is oblique in a part of its light transmitting upper face. The light transmitting part is sloped in relation to the micro-mirror element, and through which laser beams are transmitted to the micro-mirror element, and supporting parts downwardly extending from the light transmitting part. When a laser beam is input, the package separates the laser beam from noise beams, thereby improving the quality of image on a screen. By fabricating an array of window lids which correspond to micro-mirror elements, respectively, it is possible to fabricate the above-mentioned micro-mirror element package through a batch step performed in terms of a wafer size. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007034309(A) 申请公布日期 2007.02.08
申请号 JP20060205020 申请日期 2006.07.27
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHOI WON-KYOUNG;KIM WOON-BAE;MUN YONG-KWEUN;MOON CHANG-YOUL;LEE SUNG-HEE
分类号 G02B26/08 主分类号 G02B26/08
代理机构 代理人
主权项
地址