| 发明名称 |
SEMICONDUCTOR DEVICE WITH ENHANCED PAD STRUCTURE AND PAD FORMING METHOD OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with an enhanced pad structure and a pad forming method of the semiconductor device. <P>SOLUTION: The semiconductor device includes an integrated circuit and a pad coupled to the integrated circuit. The pad has a probing area and a bonding area, and a material of the pad has multiple heights from the probing area to the bonding area. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
| 申请公布号 |
JP2007036252(A) |
申请公布日期 |
2007.02.08 |
| 申请号 |
JP20060202520 |
申请日期 |
2006.07.25 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KIM YOUNG-DAE;RYU JUNG-SU;CHUNG YEON-KEUN |
| 分类号 |
H01L21/60;H01L21/3205;H01L21/66;H01L23/52 |
主分类号 |
H01L21/60 |
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