发明名称 EPOXY RESIN COMPOSITION FOR MOLDING MATERIAL, MOLDED AND CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING THE MOLDED AND CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a molding material, capable of expressing excellent mechanical characteristics and heat resistance of a cured product obtained by an epoxy resin/acid anhydride curing agent system and capable of being cured at a low temperature, to provide a molded and cured product thereof, and to provide a method for producing the molded and cured product. SOLUTION: This epoxy resin composition for the molding material contains an epoxy resin (A), an acid anhydride-based curing agent (B), and a curing accelerator (C), wherein the curing accelerator (C) comprises 1,2-dimethylimidazole. The method for producing the molded and cured product comprises casting the epoxy resin composition for molding, and then heating and curing the composition at 70-100°C. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007031476(A) 申请公布日期 2007.02.08
申请号 JP20050212738 申请日期 2005.07.22
申请人 DAINIPPON INK & CHEM INC 发明人 MIYAZAWA MASASHI;KAMEYAMA YASUSHI
分类号 C08G59/58;C08J5/00;C08L63/00 主分类号 C08G59/58
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