| 摘要 |
PROBLEM TO BE SOLVED: To provide a component-packaging apparatus and a component-packaging method capable of efficiently performing component-packaging operation for manufacturing a semiconductor device in a chip-on-chip structure without damaging components. SOLUTION: In the component-packaging apparatus for packaging an upper chip 15 on a lower one 14 for forming a mounting body in a chip-on-chip structure, the upper and lower chips 15, 14 are taken out and carried by a first component holding nozzle 22A made of a soft material fitted from a component storage section 2 to a component transfer head 21. The lower chip 14 is mounted on a packaging stage 18 and the upper chip 15 is supplied to a packaging head 27. The mounting body in which the upper chip 15 is packaged on the lower one 14 is held by a second heat-resistant component holding nozzle 22B fitted to the component transfer head 21 and stored at a first component tray 13A in the component storage section 2 from the packaging stage 18. COPYRIGHT: (C)2007,JPO&INPIT
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