发明名称 Memory module and method thereof
摘要 A memory module and method thereof are provided. In the example method, a test signal may be applied to a plurality of memory chips included in the memory module. Output data from the plurality of memory chips may be received in response to the applied test signal. The received, output data may be divided into a plurality of groups. At least one of the plurality of groups may be selected in response to an output group selection signal. The at least one selected group may be output (e.g., to an external device). The example memory module may include a plurality of chips and a hub. The example memory module may be configured to perform the above-described example method.
申请公布号 US2007030814(A1) 申请公布日期 2007.02.08
申请号 US20060489446 申请日期 2006.07.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN SEUNG-MAN;SHIN HUI-CHONG;LEE JONG-GEON;HAN KYUNG-HEE
分类号 H04L12/26 主分类号 H04L12/26
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