| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for treating a semiconductor or die having arrays of solder bumps on the surface of a substrate prior to applying solvent free underfill to the substrate, and to solve an conventional problem on the removal of an underfill layer when bumps are exposed. SOLUTION: The method for applying solvent-free underfill on the semiconductor having solder bump arrays on its surface includes (i) preparing underfill in a compressible state on the semiconductor, (ii) bringing the underfill into contact with a compliant surface and expose bumps by putting sufficient pressure. (iii) curing the underfill to change into solid state in some cases, and (iv) removing the compliant surface. COPYRIGHT: (C)2007,JPO&INPIT
|
