| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small-sized high frequency module with excellent characteristics that can enhance isolation characteristics between terminals of a semiconductor integrated circuit element without revising the structure of the semiconductor integrated circuit element. <P>SOLUTION: The high frequency module is arranged between an antenna terminal and a transmission system circuit or a reception system circuit of a plurality of communication systems adopting different frequency bands or different communication methods and is characterized in to include: the semiconductor integrated circuit element 2 wherein a high frequency switch switchable to the communication systems and a control circuit for controlling switching of the high frequency switch are integrated; a filter element 3 connected to a transmission terminal of the semiconductor integrated circuit element 2 and for attenuating harmonic signals in a transmission signal; and a lead frame 1 mounted with the semiconductor integrated circuit element 2 and the filter element 3, and the filter element 3 is mounted on the lead frame and the semiconductor integrated circuit element 2 is mounted on the filter element 3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
