| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can restrain a concentration of a pressing force in mounting on a specific portion between a plurality of pad strings. <P>SOLUTION: A semiconductor device chip 10 comprises two pads 13a of a first string, a pad 13b of a second string, and two pads 13c of a third string. These are disposed along an edge of the semiconductor device chip 10, and the pad 13b of the second string is located between the two pads 13a of the first string and between the two pads 13c of the third string in an X-axis direction. A spacing between the pad 13b of the second string and the pad 13a of the first string is equal to or more than 0, and a spacing between the pad 13b of the second string and the pad 13c of the third string is equal to or more than 0. <P>COPYRIGHT: (C)2007,JPO&INPIT |
