| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device capable of preventing the invasion of a matter into the inside thereof, and miniaturized while having high heat dissipating efficiency. <P>SOLUTION: The semiconductor laser device is provided with a metal plate 1, a light receiving and emitting unit provided on the metal plate 1 and comprising a photo receptor element and a light emitting element, a flexible sheet 5 with at least one part thereof electrically connected to the light receiving and emitting unit on the metal plate 1, a glass substrate 7 above the metal plate 1, and sealing substrates 6a, 6b on the upper side of the metal plate 1. In this case, grooves 1a, 1b and grooves 7a, 7b are provided on the opposite surface of the metal plate 1 and the glass substrate 7, respectively. The sealing substrate 6a is fitted into the groove 1a and the groove 7a, but the sealing substrate 6b is fitted into the groove 1b and the groove 7b. <P>COPYRIGHT: (C)2007,JPO&INPIT |
