发明名称 COATING COMPOSITION AND ITS MANUFACTURING METHOD, AND RESIN MOLDING AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a coating composition which is capable of forming a resin molding having the effects of dew condensation prevention, humidity control, antifouling, cooling (humidity release cooling, humidity release endothermic property), and/or durability, and exhibits an excellent coatability and/or an excellent appearance of a surface coated therewith. SOLUTION: The coating composition comprises an inorganic porous material, a binder resin, and a solvent. In the coating composition, (1) the inorganic porous material contains at least one type of a silicon compound; (2) the binder resin has (a) a hydroxy group valence of a solid content thereof of not less than 5 mgKOH/g and not more than 80 mgKOH/g, and (b) a glass transition temperature (Tg) of not less than -5°C and not more than 40°C; and (3) the solvent contains at least one type of an organic solvent. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007031710(A) 申请公布日期 2007.02.08
申请号 JP20060175536 申请日期 2006.06.26
申请人 MITSUBISHI CHEMICALS CORP 发明人 MORI HIROSHI;SHIMOYAMA MASARU;TSURUTA YUKO
分类号 C09D201/06;B05D7/24;C09D7/12;D06M11/79 主分类号 C09D201/06
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