| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-pack resin composition having excellent quick curability by heating at low temperatures, good storage stability (preservation stability) and high adhesive strength without causing separation and un-curing during heat curing. SOLUTION: The heat-curing type one-pack resin composition consists essentially of the following (1)-(5). (1) a component containing one or more compounds represented by (A) a compound containing≥2 thiirane rings in the molecule, (B) a compound containing both a thiirane ring and an oxirane ring in the molecule and (C) a compound containing one or more oxirane rings and no thiirane ring in the molecule in (40/60) to (10/90) ratio of the numbers of the contained oxirane rings/thiirane rings or a mixture of the compounds, (2) a component of a thiol compound having one or more thiol groups in the molecule, (3) a component of a heat latent curing accelerator, (4) a component of core-shell type acrylic rubber micro-particles and (5) a component of an acidic compound and/or boric esters. COPYRIGHT: (C)2007,JPO&INPIT
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