发明名称 Conductive resin composition and molded object
摘要 A conductive resin composition produced by melt-kneading a mixture comprising a polyamide (A), a polyphenylene ether (B) (non-terminal-modified polyphenylene ether and/or terminal-modified polyphenylene ether), a rubbery polymer (C), a conductive carbonaceous material (D) (carbon black and/or carbon fibril), and a low molecular weight modifier compound (E) (compatibility agent), wherein the mixture has the following characteristics: (1) the amount of (D) is 0.2 to 3% by weight, based on the total weight of (A) to (E), (2) the amount of (E) is more than 0.01% by weight and less than 0.20% by weight, based on the total weight of (A) to (E), and (3) the amount (a) of a volatile substance contained in (B) satisfies the following formula: 0<=a<=-7.3xE+1.83, wherein E is the % by weight of (E), based on the total weight of (A) to (E), the amount (a) being expressed in terms of a weight decrease (% by weight) of (B) as measured by subjecting (B) to vacuum drying in vacuo at 180 ° C. for 1 hour.
申请公布号 US2007029530(A1) 申请公布日期 2007.02.08
申请号 US20060570272 申请日期 2006.03.02
申请人 ASAHI KASEI CHEMICALS CORPORATION 发明人 NODA KAZUYA;NISHINO HIROSHI;SAKATA NORIO
分类号 H01B1/24;C08K3/04;C08K7/06;C08L21/00;C08L53/02;C08L71/12;C08L77/00;C08L77/02;C08L77/06 主分类号 H01B1/24
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