| 发明名称 |
METHOD FOR FORMING ELECTRODE PAD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME |
| 摘要 |
<p>A method for forming a pad in a semiconductor device and a semiconductor device having the pad are provided to decrease an area of a chip by forming a pad metal on an input/output circuit. A lower metal layer(30) is formed on a semiconductor substrate(10), and an insulating layer(20) is formed on the lower pad metal. A via hole is formed on the insulating layer in a rectangular shape. A metal is formed on the via hole to form a via plug(41) in a rectangular ring. An upper pad metal(50) is formed on a substrate with the via plug formed thereon. The lower pad metal is formed on an input/output circuit. The via plug is made of aluminium or tungsten.</p> |
| 申请公布号 |
KR100683388(B1) |
申请公布日期 |
2007.02.08 |
| 申请号 |
KR20050134158 |
申请日期 |
2005.12.29 |
| 申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
LEE, YONG GEUN |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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