| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is easy to design without taking an inductor for individual wires problematic for IC design into account, by uniforming the lengths of wires to be used for high-speed differential transmission of 1 GHz or more in frequency, and to provide a manufacturing method thereof. <P>SOLUTION: The semiconductor device is used for high-speed differential transmission of 1 GHz or more in frequency. When viewed from a vertical direction to wiring of a substrate 7, bonding wires 3, 4, 5, and 6 are used for a differential signal pair for transmission, reception and transmission/reception in the same function, and are made uniform in length. <P>COPYRIGHT: (C)2007,JPO&INPIT |
