| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method that is relatively simple in technical terms, by which semiconductor wafers having local surface flatness even in their peripheral regions can be obtained, thereby meeting a requirement in which the flatness is a parameter-related precondition to manufacture electronic constituents in the present and future generations. <P>SOLUTION: A method is provided to process semiconductor wafers so that they get thinner than a carrier body and thicker than inserts that are inserted in their respective cutouts in the carrier to protect the semiconductor wafers. <P>COPYRIGHT: (C)2007,JPO&INPIT |
