| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a printed wiring board more quickly, without having to repeat trial production many times. SOLUTION: In a step S12, when a component is arranged on the printed wiring substrate, a circuit and a layout paper of the printed wiring board are designed, based on the value expected that it satisfies a prescribed standard. In a step S15, the printed wiring board is prepared by using the designed layout paper. In step S16, it is decided whether a value of a differential impedance of a pseudo-circuit pattern newly manufactured together with the printed wiring board is a value inside a specified range decided, based on the value of the differential impedance measured in the step S16, to inspect whether the manufactured printed wiring board is nondefective. This invention can be applied to the printed wiring board based on a DVI. COPYRIGHT: (C)2007,JPO&INPIT
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