SOLDERING DEVICE AND MANUFACTURING METHOD FOR SOLDERED DEVICE

摘要

PROBLEM TO BE SOLVED: To uniformly solder circuit components to a substrate by heating and melting a solder material arranged at each place on the substrate. SOLUTION: The soldering device 10 is provided with an induction coil 11 whose longitudinal length L is formed longer than the length of the substrate. A space inside the induction coil 11 has a size sufficient for arranging the substrate. An AC magnetic field is generated by the induction coil in a state that the substrate is arranged at the nearly central part of the induction coil 11 in the plane being the inside of the induction coil and parallel to a winding. The solder materials on the substrate can be uniformly heated and melted since magnetic fluxes pass the substrate in parallel and nearly uniformly inside the induction coil 11. Consequently, it is possible to uniformly solder the circuit components arranged at respective places on the substrate to the substrate since the solder materials can be uniformly heated and melted. COPYRIGHT: (C)2007,JPO&INPIT