| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor device while securing high yields. SOLUTION: A recess 6 is formed on the surface of a semiconductor substrate 1, and a projection 8 corresponding to the recess 6 is formed on an insulating substrate 7 made of glass, or the like. The recess 6 is fitted to the projection 8, and the semiconductor substrate 1 and the insulating substrate 7 are joined through an adhesive layer 14. A pad electrode 3 formed on the surface of the semiconductor substrate 1 and a conductive terminal 20 formed on the backside are electrically connected through wiring layers (a first wiring layer 9 + a second wiring layer 16) formed along the junction surface of the semiconductor substrate 1 and the insulating substrate 7. COPYRIGHT: (C)2007,JPO&INPIT
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