| 摘要 |
PROBLEM TO BE SOLVED: To reduce the organic substance contamination of a body to be processed in a vacuum processing system. SOLUTION: An exhaust mechanism 38 for evacuating the inside of a chamber and a purge gas supplying unit 44 for supplying purge gas into the chamber are connected to load lock chambers 20(22). During a semiconductor wafer W is staying in the load lock chambers 20(22), the exhaust mechanism 38 exhausts the inside of the chambers with a given exhausting amount while the flow of purge gas supplied from a purge gas supplying unit 44 is controlled by a controller 48, a vacuum meter 46 and a flow rate adjusting valve 40 whereby a pressure in the load lock chambers 20(22) is retained at a set value. This set pressure is selected within the range of several ten-several hundred Pa, which are effective for the prevention or reduction of the organic substance contamination, and can be selected so as to be higher (preferably within the range of 1-2 times) than the pressure of a conveyance chamber 10. COPYRIGHT: (C)2007,JPO&INPIT
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