| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield plate which can easily be conducted with a ground pattern of a circuit board when the shield plate is arranged on the opposite face of the circuit board where the ground pattern is formed. SOLUTION: The shield plate 4 is provided with two substrate by-pass grounds 221. The substrate by-pass grounds 221 are brought into contact with the ground pattern 9 of a one-side panel substrate 6b having a pattern forming face 12 where the ground pattern 9 is formed on a substrate surface only on one face by making it detour from the pattern non-forming face 13 of the one side panel substrate 6b. Thus, the shield plate 4 is fixed. Consequently, the shield plate 4 and the ground pattern 9 can securely be made conductive. Noise on the one side panel substrate 6 can be reduced and an operation failure caused by the dispersion of a potential level can be reduced. Since an assembling process can be simplified, productivity can also be improved. COPYRIGHT: (C)2007,JPO&INPIT
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