发明名称 EMBEDDED STRUCTURE GROUNDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semipermanent embedded structure grounding device without the need for boring a through-hole in a box of a manhole member for mounting a grounding body, therefore, without the need for a waterproof sealing treatment process for blocking such a through-hole, and therefore, realizing shortening of its installation work without the need for repair or the like of waterproof points and without any running cost. SOLUTION: The device is so structured to have a grounding body 3 arranged in a box 1b of a manhole member 1 buried in the ground G, through conductive cement filled in a groove of an insulating gutter-like member 3a forming the grounding body 3, or through conductive cement attached to the box 1b of the manhole member 1 with the conductive cement and the grounding body 3 installed therein. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007035448(A) 申请公布日期 2007.02.08
申请号 JP20050217157 申请日期 2005.07.27
申请人 TOKYO ELECTRIC POWER CO INC:THE;SANKOSHA CORP 发明人 MIYAUCHI YASUSHI;NAKAZAWA HISASHI;ISHIZAKI MAKOTO
分类号 H01R4/66 主分类号 H01R4/66
代理机构 代理人
主权项
地址