| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid droplet discharging head which can suppress the occurrence of a poor bonding resulting from a positional slip at the conductive bonded section where an energy generating means and a board are electrically connected even when the area of the board used for feeding a driving signal to the energy generating means is enlarged. SOLUTION: In an FPC 50 for feeding a driving signal to a piezoelectric element of an inkjet recording unit, an interval for a plurality of solder bumps which are loaded on a solder bump loading section 50B is set in a manner to become narrower than an interval of electrode pad sections of the piezoelectric element as a distance from a reference mark 54 becomes longer. When a plurality of the solder bumps 34 are bonded by melting by positioning them at the electrode pad sections and heating them by using the reference mark 54, even at a location where the positional slipping amount of the solder bump 34 becomes larger by the thermal expansion of the FPC 50 resulting from the enlargement of the distance from the reference mark 54, the solder bump 34 is adjusted to a proper position to the electrode pad section, and a favorable bonded state can be obtained. COPYRIGHT: (C)2007,JPO&INPIT
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