发明名称 Harzzusammensetzung und flexible Leiterplattenanordung
摘要 A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300 DEG C or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5 - 8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 mu m or below, thickness b: 1.0 mu m or below, and aspect ratio (a/b): 20 or above.
申请公布号 DE60032647(D1) 申请公布日期 2007.02.08
申请号 DE2000632647 申请日期 2000.11.29
申请人 OTSUKA CHEMICAL CO. LTD. 发明人 KAWAGUCHI, AKIYOSHI;ISHII, YOSHIAKI;TSUTSUMI,HIDEYUKI;TANAKA, TOMOHIRO
分类号 C08L101/00;C08K3/00;C08K3/34;C08K7/00;C08K9/00;H05K1/00;H05K1/03 主分类号 C08L101/00
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