发明名称 |
Harzzusammensetzung und flexible Leiterplattenanordung |
摘要 |
A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300 DEG C or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5 - 8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 mu m or below, thickness b: 1.0 mu m or below, and aspect ratio (a/b): 20 or above. |
申请公布号 |
DE60032647(D1) |
申请公布日期 |
2007.02.08 |
申请号 |
DE2000632647 |
申请日期 |
2000.11.29 |
申请人 |
OTSUKA CHEMICAL CO. LTD. |
发明人 |
KAWAGUCHI, AKIYOSHI;ISHII, YOSHIAKI;TSUTSUMI,HIDEYUKI;TANAKA, TOMOHIRO |
分类号 |
C08L101/00;C08K3/00;C08K3/34;C08K7/00;C08K9/00;H05K1/00;H05K1/03 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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